2010-8-12 15:34:16PRINT
Bystronic introduced the new laser-cutting Machine
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At the beginning of May 2010, Bystronic introduced the laser-cutting Machine with high speed BySprintPro3015 in China.
This machine adopts semiconductor laser generator with 4400w power source with low energy consumption, whose cutting speed can reach 50m/min for 1mm metal plate. The machine has many technical tricks like automatic selection technique for technology parameter ATS, automatic observation syst em with CLS focus lamp, automatic observation system with OCS output display. The machine can meet all requirements like high efficiency, high reliability, high stability etc.
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